Micron Technology, Inc.
VOID FORMATION FOR CHARGE TRAP STRUCTURES
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Abstract:
Various embodiments include methods and apparatus having a number of charge trap structures, where each charge trap structure includes a dielectric barrier between a gate and a blocking dielectric region, the blocking dielectric region located on a charge trap region of the charge trap structure. At least a portion of the gate can be separated by a void from a region which the charge trap structure is directly disposed. Additional apparatus, systems, and methods are disclosed.
Status:
Application
Type:
Utility
Filling date:
22 Feb 2021
Issue date:
1 Jul 2021