Micron Technology, Inc.
SEMICONDUCTOR DEVICE
Last updated:
Abstract:
A semiconductor device having a semiconductor die, a redistribution layer (RDL), and an encapsulant. The RDL layer can be formed on a first surface of the semiconductor die. The encapsulant can enclose a second surface and side surfaces of the semiconductor die. The encapsulant can enclose side portions of the RDL.
Status:
Application
Type:
Utility
Filling date:
16 Mar 2021
Issue date:
1 Jul 2021