Micron Technology, Inc.
MEMORY DEVICE INCLUDING DATA LINES ON MULTIPLE DEVICE LEVELS

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Abstract:

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a first pillar of a first memory cell string; a second pillar of a second memory cell string; a first conductive structure extending in a first direction, the first conductive structure located over and in electrical contact with the first pillar; a second conductive structure extending in the first direction, the second conductive structure located over and in electrical contact with the second pillar; a select gate coupled to the first and second memory cell strings; a first data line located on a first level of the apparatus and extending in a second direction, the first data line located over the first conductive structure and in electrical contact with the first conductive structure; and a second data line located on a second level of the apparatus and extending in the second direction, the second data line located over the second conductive structure and in electrical contact with the second conductive structure.

Status:
Application
Type:

Utility

Filling date:

20 Dec 2019

Issue date:

24 Jun 2021