Micron Technology, Inc.
THERMAL COOLING ELEMENT FOR MEMORY DEVICES OF A MEMORY SUB-SYSTEM

Abstract:

A memory sub-system can include multiple memory devices and a thermal cooling element. The thermal cooling element includes a bottom surface that is coupled to a top surface of each of the memory devices. Furthermore, the thermal cooling element further has a top surface that includes a protrusions that extend above the top surface of the thermal cooling element to dissipate heat that is generated from the memory devices.