Micron Technology, Inc.
THREE DIMENSIONAL MEMORY ARRAYS

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Abstract:

In an example, a memory array may include a plurality of first dielectric materials and a plurality of stacks, where each respective first dielectric material and each respective stack alternate, and where each respective stack comprises a first conductive material and a storage material. A second conductive material may pass through the plurality of first dielectric materials and the plurality of stacks. Each respective stack may further include a second dielectric material between the first conductive material and the second conductive material.

Status:
Application
Type:

Utility

Filling date:

26 Feb 2021

Issue date:

17 Jun 2021