Micron Technology, Inc.
THREE DIMENSIONAL MEMORY ARRAYS
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Abstract:
In an example, a memory array may include a plurality of first dielectric materials and a plurality of stacks, where each respective first dielectric material and each respective stack alternate, and where each respective stack comprises a first conductive material and a storage material. A second conductive material may pass through the plurality of first dielectric materials and the plurality of stacks. Each respective stack may further include a second dielectric material between the first conductive material and the second conductive material.
Status:
Application
Type:
Utility
Filling date:
26 Feb 2021
Issue date:
17 Jun 2021