Micron Technology, Inc.
STACKED INTERPOSER STRUCTURES, MICROELECTRONIC DEVICE ASSEMBLIES INCLUDING SAME, AND METHODS OF FABRICATION, AND RELATED ELECTRONIC SYSTEMS

Abstract:

An interposer comprises a semiconductor material and includes cache memory under a location on the interposer for a host device. Memory interface circuitry may also be located under one or more locations on the interposer for memory devices. Microelectronic device assemblies incorporating such an interposer and comprising a host device and multiple memory devices are also disclosed, as are methods of fabricating such microelectronic device assemblies.