Micron Technology, Inc.
PROCESSES FOR ADJUSTING DIMENSIONS OF DIELECTRIC BOND LINE MATERIALS AND RELATED FILMS, ARTICLES AND ASSEMBLIES
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Abstract:
Processes for adjusting dimensions of dielectric bond line materials in stacks of microelectronic components, and related material films, articles and assemblies.
Status:
Application
Type:
Utility
Filling date:
16 Dec 2019
Issue date:
17 Jun 2021