Micron Technology, Inc.
METHODS OF FORMING A STAIRCASE STRUCTURE
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Abstract:
Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
Status:
Application
Type:
Utility
Filling date:
11 Feb 2021
Issue date:
3 Jun 2021