NVIDIA Corporation
Chip double-sided layout on PCB

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Abstract:

The present invention provides a printed circuit board and a layout method thereof and an electronic equipment. On the printed circuit board is arranged a first processor chip and a second processor chip, wherein the first processor chip is arranged on a first surface of the printed circuit board; the second processor chip is arranged on a second surface of the printed circuit board; and a first through-hole is disposed on the printed circuit board, part of pins of the first processor chip being connected to part of pins of the second processor chip via the first through-hole. The printed circuit board, the layout method thereof and the electronic equipment provided in the present invention arrange two processor chips on different surfaces of the printed circuit board and enable the respective parts of pins of the two processor chips to pass through the printed circuit board to be connected with each other by providing a through-hole on the printed circuit board, which not only greatly saves the space on the printed circuit board and is beneficial to product miniaturization, but also reduces transmission loss of high speed circuit and component costs.

Status:
Grant
Type:

Utility

Filling date:

12 Jul 2019

Issue date:

25 Aug 2020