NVIDIA Corporation
INTER-LAYER SLOT FOR INCREASING PRINTED CIRCUIT BOARD POWER PERFORMANCE
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Abstract:
A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.
Status:
Application
Type:
Utility
Filling date:
27 Oct 2020
Issue date:
29 Apr 2021