NVIDIA Corporation
Inter-layer slot for increasing printed circuit board power performance
Last updated:
Abstract:
A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.
Status:
Grant
Type:
Utility
Filling date:
27 Oct 2020
Issue date:
6 Sep 2022