NVIDIA Corporation
Inter-layer slot for increasing printed circuit board power performance

Last updated:

Abstract:

A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.

Status:
Grant
Type:

Utility

Filling date:

27 Oct 2020

Issue date:

6 Sep 2022