Parker-Hannifin Corporation
Electronics housing with heat sink

Last updated:

Abstract:

An electronic housing assembly includes a polymeric housing base and a metallic heat sink secured to the housing base with a snap-fit engagement. A printed circuit board is positioned within a cavity in the housing assembly and is protected within the housing by an environmental seal. The electronic housing assembly allows for expansion and contraction between the heat sink and the housing while maintaining the integrity of the seal.

Status:
Grant
Type:

Utility

Filling date:

3 Oct 2018

Issue date:

23 Feb 2021