Parker-Hannifin Corporation
Thermal interface material

Abstract:

Thermal thermally conductive interfaces are used in electronic devices for heat transfer between, for example, the mating heat transfer surfaces of a heat-generating, electronic component, such as an integrated circuit (IC) chip, and a thermal dissipation member, such as a heat sink or spreader, for the conductive cooling of the electronic component. The thermally conductive interface includes a heat spreading material formed of a flexible, lamellar graphite material having a plurality of coarse perforations therein; and a coating of a thermally-conductive phase change material joined to the surface of the graphite material.