QUALCOMM Incorporated
High voltage (HV) metal oxide semiconductor field effect transistor (MOSFET) in semiconductor on insulator (SOI) technology

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Abstract:

A method of constructing an integrated circuit (IC) includes fabricating a metal oxide semiconductor field effect transistor (MOSFET) on a first surface of an insulator layer of the integrated circuit. The insulator layer is supported by a sacrificial substrate. The MOSFET includes an extended drain region. The method deposits a front-side dielectric layer on the MOSFET, bonds a handle substrate to the front-side dielectric layer, and then removes the sacrificial substrate. The method also fabricates multiple back gates on a second surface of the insulator layer. The second surface is opposite the first surface.

Status:
Grant
Type:

Utility

Filling date:

11 Feb 2020

Issue date:

3 Aug 2021