QUALCOMM Incorporated
Integrated circuit with cells having metal layer configured based on directions from which intercell metal interconnects connects to the metal layer

Last updated:

Abstract:

An integrated circuit (IC), including a first integrated circuit (IC) cell configured to perform a defined operation on a first input signal to generate a first output signal, wherein the first IC cell includes a first metal configured to receive the first input signal or output the first output signal; and a second IC cell configured to perform the defined operation on a second input signal to generate a second output signal, wherein the second IC cell includes a second metal configured to receive the second input signal or the second output signal, wherein the second metal is located substantially in the same location within the second IC cell as the first metal is located within the first IC cell, and wherein the first and second metals are configured differently based on differences in first and second intercell metal interconnects to which the first and second metals electrically connect, respectively.

Status:
Grant
Type:

Utility

Filling date:

29 Oct 2019

Issue date:

24 Aug 2021