QUALCOMM Incorporated
PACKAGE WITH INTEGRATED STRUCTURE

Abstract:

Examples herein include better heat transfer from application processor(s) and power management system without affecting the EMI performance. In one example, a thermal solution structure improves thermal performance of a modular system with better EMI shielding with the addition of heat conduction pillars from the substrate metal layer to TIM material, which thereafter connects to a heat pipe. The pillar transfers heat from substrate to heat pipe and connects physically to a global ground reference net of the IC package and eventually to a system motherboard while the pillar shields components inside the array/ring. This gives both a thermal and EMI shield solution in a single structure.