QUALCOMM Incorporated
STACKED MODULE PACKAGE INTERCONNECT STRUCTURE WITH FLEX CABLE

Abstract:

Certain aspects of the present disclosure provide apparatus and techniques for connecting packages for integrated circuits or packaged assemblies with other packages or modules using flex cables. An example packaged assembly for integrated circuits includes: a first integrated circuit (IC) package, a second IC package disposed above the first IC package, and a flex cable, wherein an end of the flex cable is connected to at least one of the first IC package or the second IC package.