QUALCOMM Incorporated
Electromagnetic interference shielding for packages and modules
Last updated:
Abstract:
Disclosed is an apparatus and methods for making same. The apparatus includes a substrate, a set of electrical contacts disposed on the surface of the substrate, and an electromagnetic interference (EMI) shield pedestal structure, disposed between an outer periphery of the set of electrical contacts and an outer portion of the substrate.
Status:
Grant
Type:
Utility
Filling date:
2 Sep 2020
Issue date:
16 Nov 2021