QUALCOMM Incorporated
X.5 layer substrate

Abstract:

X.5 layer substrates that do not use an embedded traces substrate process during formation may produce a high yield with relaxed L/S in a short manufacturing time (only 4.times. lamination process without a detach process) at a low cost. For example, a substrate may include an mSAP, two landing pads, two escape lines, two bump pads, and a photo-imageable dielectric layer on the mSAP patterned substrate.