QUALCOMM Incorporated
INTEGRAL SUPER-CAPACITOR FOR LOW POWER APPLICATIONS
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Abstract:
Certain aspects of the present disclosure generally relate to an electronic device with a circuit board having one or more super-capacitors implemented therein using the layers of the circuit board. An example electronic device generally includes a circuit board having a capacitive element implemented therein, wherein the capacitive element comprises a first conductive layer, a second conductive layer disposed below the first conductive layer, and a solid dielectric material disposed between the first and second conductive layers, wherein the dielectric material has a high dielectric constant greater than 10,000 (1E4); and an integrated circuit coupled to the circuit board.
Status:
Application
Type:
Utility
Filling date:
29 Apr 2020
Issue date:
4 Nov 2021