QUALCOMM Incorporated
Device comprising contact to contact coupling of packages

Abstract:

A device that includes a first package and a second package coupled to the first package. The first package includes a first integrated device, a first encapsulation layer encapsulating the first integrated device, a plurality of vias traveling through the first encapsulation layer, a first redistribution portion comprising a first plurality of redistribution interconnects, wherein the first redistribution portion is coupled to the first encapsulation layer, and a first plurality of contacts coupled to the first integrated device. The second package includes a passive device, a second encapsulation layer encapsulating the passive device, a second redistribution portion comprising a second plurality of redistribution interconnects, wherein the second redistribution portion is coupled to the passive device and the second encapsulation layer, and a second plurality of contacts coupled to the passive device, wherein the second plurality of contacts is coupled to the first plurality of contacts from the first package.