QUALCOMM Incorporated
MIMCAP ARCHITECTURE

Abstract:

A cell on an IC includes a first set of M.sub.x layer interconnects coupled to a first voltage, a second set of M.sub.x layer interconnects coupled to a second voltage different than the first voltage, and a MIM capacitor structure below the M.sub.x layer. The MIM capacitor structure includes a CTM, a CBM, and an insulator between portions of the CTM and the CBM. The first set of M.sub.x layer interconnects is coupled to the CTM. The second set of M.sub.x layer interconnects is coupled to the CBM. The MIM capacitor structure is between the M.sub.x layer and an M.sub.x-1 layer. The MIM capacitor structure includes a plurality of openings. The MIM capacitor structure is continuous within the cell and extends to at least two edges of the cell. In one configuration, the MIM capacitor structure extends to each edge of the cell.