QUALCOMM Incorporated
MULTICORE SUBSTRATE

Abstract:

Various package configurations and methods of fabricating the same are disclosed. In some aspects, a package may include a core layer and a first layer directly attached to a first side of the core layer, where a first device is embedded in the first layer. A second layer can be directly attached to a second side of the core layer opposite the first side, where a second passive device is embedded in the second layer. A first build-up layer can be directly attached to the first layer opposite the core layer, and a second build-up layer can be directly attached to the second layer opposite the core layer.