QUALCOMM Incorporated
PACKAGE CAVITY FOR ENHANCED DEVICE PERFORMANCE WITH AN INTEGRATED PASSIVE DEVICE

Abstract:

An integrated circuit (IC) package is described. The IC package includes a package die and die interconnects on an active surface of the package die. The IC package also includes an integrated passive device (IPD) coupled to the active surface of the package die, between the plurality of die interconnects. A portion of the IPD extends beyond a Z-height of the die interconnects. The IC package further includes a package substrate coupled to the die interconnects, the package substrate having a cavity to receive the portion of the IPD.