QUALCOMM Incorporated
INTEGRATING A GATE-ALL-AROUND (GAA) TRANSISTOR WITH A SILICON GERMANIUM (SiGe) HETEROJUNCTION BIPOLAR TRANSISTOR (HBT)
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Abstract:
Certain aspects of the present disclosure generally relate to a semiconductor device with a heterojunction bipolar transistor (HBT) integrated with a gate-all-around (GAA) transistor. One example semiconductor device generally includes a first substrate, a second substrate adjacent to the first substrate, a GAA transistor disposed above the first substrate, and a HBT disposed above the second substrate. Other aspects of the present disclosure generally relate to a method for fabricating a semiconductor device. An exemplary fabrication method generally comprises forming a GAA transistor disposed above a first substrate and forming a HBT disposed above a second substrate, wherein the second substrate is adjacent to the first substrate.
Utility
22 Jun 2020
23 Dec 2021