QUALCOMM Incorporated
PATTERNING OF ORGANIC FILM BY WET ETCHING PROCESS

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Abstract:

An organic film is patterned without applying a hard mask or photolithography. A hydrophilic solvent-soluble resist is placed and arranged on the organic film using a non-lithography process. The hydrophilic solvent-soluble resist is placed and arranged using a printing or lamination process. The organic film is patterned using a wet etchant that is selective to the organic film but non-selective to the hydrophilic solvent-soluble resist. The hydrophilic solvent-soluble resist protects the underlying organic film from contamination and damage, prevents undercutting, and assists in providing a desired taper profile during patterning.

Status:
Application
Type:

Utility

Filling date:

19 Jun 2020

Issue date:

23 Dec 2021