QUALCOMM Incorporated
Substrate comprising at least one patterned ground plane for shielding

Abstract:

A substrate that includes at least one dielectric layer, a first inductor formed in the at least one dielectric layer, a second inductor formed in the at least one dielectric layer, and a patterned ground layer formed on a metal layer of the substrate. The patterned ground layer is configured to provide electromagnetic (EM) shielding. The patterned ground layer includes a plurality of slots. The plurality of slots may be filled with the at least one dielectric layer. The plurality of slots may include a slot with a rectangular shape, a slot with a polygon shape, a slot with a circular shape, or combinations thereof. The patterned ground layer may include at least one slot that, individually or collectively, has a shape of a spiral.