QUALCOMM Incorporated
Integrated circuits (ICs) employing front side (FS) back end-of-line (BEOL) (FS-BEOL) input/output (I/O) routing and back side (BS) BEOL (BS-BEOL) power routing for current flow organization, and related methods

Abstract:

Integrated circuits (ICs) employing front side (FS) back end-of-line (BEOL) (FS-BEOL) input/output (I/O) routing and back side (BS)) BEOL (BS-BEOL) power routing for current flow organization, and related IC packages and methods of fabricating are disclosed. The IC includes a FS-BEOL metallization structure disposed on a first side of a semiconductor layer and a BS-BEOL metallization structure disposed on a second side of the semiconductor layer. The FS-BEOL metallization structure is configured to route I/O signals to the semiconductor devices. The FS-BEOL metallization structure of the IC is also configured to receive power signals to be routed to the semiconductor devices. However, to avoid the need to route the power signals to semiconductor devices through the FS-BEOL metallization structure, thus increasing routing density and complexity the FS-BEOL metallization structure, the power signals are routed from the FS-BEOL metallization structure to the BS-BEOL metallization structure and to semiconductor devices for power.