QUALCOMM Incorporated
DRY ETCH BACK SUBSTRATE INTERCONNECTIONS

Abstract:

A method of forming electrical interconnections comprises patterning a trace on a dielectric layer and then masking the dielectric layer for plating. The dielectric layer is plated to form electrical interconnections. After plating the masking is removed. A laser etch back of the trace is performed after removing the masking, in which the laser etch back removes tails on the trace. After the laser etch back, the patterned traces and the dielectric layer are cleaned.