QUALCOMM Incorporated
Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration

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Abstract:

A semiconductor device having metamorphic high electron mobility transistor (HEMT)-heterojunction bipolar transistor (HBT) integration on a semiconductor substrate. An example semiconductor device generally includes a semiconductor substrate, a bipolar junction transistor (BJT) disposed above the semiconductor substrate and comprising indium, and a HEMT disposed above the semiconductor substrate and comprising indium.

Status:
Grant
Type:

Utility

Filling date:

12 Jun 2020

Issue date:

5 Jul 2022