QUALCOMM Incorporated
Hybrid low resistance metal lines
Last updated:
Abstract:
Disclosed are standard cells and methods for fabricating standard cells used in semiconductor device design and fabrication. Aspects disclosed include a standard cell having a plurality of wide metal lines. The wide metal lines being formed from copper. The standard cell also includes a plurality of narrow metal lines. The narrow metal lines are formed from a material that has a lower resistance than copper for line widths on the order of twelve nanometers or less.
Status:
Grant
Type:
Utility
Filling date:
3 Dec 2019
Issue date:
2 Aug 2022