QUALCOMM Incorporated
Surface mount passive component shorted together and a die

Last updated:

Abstract:

A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.

Status:
Grant
Type:

Utility

Filling date:

19 Feb 2020

Issue date:

2 Aug 2022