QUALCOMM Incorporated
Memory system design for signal integrity crosstalk reduction with asymmetry

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Abstract:

An integrated circuit is described. The integrated circuit (IC) may include a printed circuit board (PCB). The IC may also include a system on chip (SoC) die on the PCB. The IC may further include a memory device coupled to a parallel memory interface of the SoC die. The memory device may be coupled to a parallel memory interface through parallel signal traces arranged in an asymmetric routing. In the asymmetric routing of the parallel signal traces, the signal traces are arranged according to a variable spacing is between the parallel signal traces for a majority portion of the parallel signal traces.

Status:
Grant
Type:

Utility

Filling date:

14 Jun 2019

Issue date:

13 Sep 2022