QUALCOMM Incorporated
Patch substrate configured as a shield located over a cavity of a board

Abstract:

A device that includes a board, a package and a patch substrate. The board includes a cavity. The package is coupled to a first side of the board. The package includes a substrate and an integrated device coupled to the substrate. The integrated device is located at least partially in the cavity of the board. The patch substrate is coupled to a second side of the board. The patch substrate is located over the cavity of the board. The patch substrate is configured as an electromagnetic interference (EMI) shield for the package.