QUALCOMM Incorporated
Package including a substrate with high resolution rectangular cross-section interconnects
Last updated:
Abstract:
A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, wherein at least one of the interconnects has a rectangular side cross-section having at least one corner with a corner radius less than a corner radius threshold.
Status:
Grant
Type:
Utility
Filling date:
28 Jul 2020
Issue date:
20 Sep 2022