QUALCOMM Incorporated
Subslot bundling and acknowledgement

Abstract:

A first apparatus may puncture, in at least two subslots, a first type of data or control information with a second type of data or control information. The first apparatus may bundle the least two subslots within a subframe, and the subframe may include a portion for carrying acknowledgment (ACK)/negative acknowledgment (NACK) information associated with the second type of data or control information. The first apparatus may communicate with a user equipment (UE) during the at least two subslots within the subframe. A second apparatus may receive ACK/NACK information associated with a second type of data or control information. The second apparatus may reduce a transmission power for a first type of data or control information during a subsequent subframe when the ACK/NACK information indicates a negative acknowledgement.