QUALCOMM Incorporated
HYBRID CONDUCTOR INTEGRATION IN POWER RAIL

Abstract:

Certain aspects of the present disclosure generally relate to integration of a hybrid conductor material in power rails of a semiconductor device. An example semiconductor device generally includes an active electrical device and a power rail. The power rail is electrically coupled to the active electrical device, disposed above the active electrical device, and embedded in at least one dielectric layer. The power rail comprises a first conductive layer, a barrier layer, and a second conductive layer comprising copper. The barrier layer is disposed between the first conductive layer and the second conductive layer.