QUALCOMM Incorporated
INTEGRATED PASSIVE DEVICE (IPD) COUPLED TO FRONT SIDE OF INTEGRATED DEVICE

Abstract:

A device that includes an integrated device, a plurality of solder interconnects, and an integrated passive device (IPD). The integrated device includes a die having a front side and back side, and a metallization portion coupled to the front side of the die. The metallization portion includes at least one metallization layer and a plurality of under bump metallization (UBM) interconnects. The plurality of solder interconnects is coupled to the metallization portion. The integrated passive device (IPD) is coupled to the metallization portion of the integrated device such that the IPD is located between at least two solder interconnects from the plurality of solder interconnects.