QUALCOMM Incorporated
NANOSHEET (NS) AND FIN FIELD-EFFECT TRANSISTOR (FINFET) HYBRID INTEGRATION
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Abstract:
Certain aspects of the present disclosure are directed to a semiconductor device. The semiconductor device generally includes a substrate, at least one silicon-on-insulator (SOI) transistor disposed above the substrate, a gate-all-around (GAA) transistor disposed above the substrate, and a fin field-effect transistor (FinFET) disposed above the substrate.
Status:
Grant
Type:
Utility
Filling date:
12 Dec 2019
Issue date:
17 Jun 2021