Quantum-Si incorporated
INTEGRATED PHOTODETECTOR WITH DIRECT BINNING PIXEL
Last updated:
Abstract:
An integrated circuit includes a photodetection region configured to receive incident photons. The photodetection region is configured to produce a plurality of charge carriers in response to the incident photons. The integrated circuit includes at least one charge carrier storage region. The integrated circuit also includes a charge carrier segregation structure configured to selectively direct charge carriers of the plurality of charge carriers directly into the at least one charge carrier storage region based upon times at which the charge carriers are produced.
Status:
Application
Type:
Utility
Filling date:
2 Aug 2021
Issue date:
20 Jan 2022