Rogers Corporation
LOW LOSS DIELECTRIC COMPOSITE COMPRISING A HYDROPHOBIZED FUSED SILICA

Abstract:

In an embodiment, a dielectric composite comprises a thermoset derived from a functionalized poly(arylene ether). a triallyl (iso)cyanurate, and a functionalized block copolymer; a hydrophobized fused silica; and a reinforcing fabric. The dielectric composite can be prepared by forming a thermosetting composition comprising the methacrylate functionalized poly(arylene ether), the triallyl (iso)cyanurate, the functionalized block copolymer, the hydrophobized fused silica, an initiator, and a solvent; coating the reinforcing fabric with the thermosetting composition; at least partially curing the thermosetting composition to form a prepreg; and optionally laminating the prepreg and at least one electrically conductive layer to form the circuit material.