Science Applications International Corporation
Edge interconnects for use with circuit boards and integrated circuits
Last updated:
Abstract:
A substrate assembly includes at least one printed circuit (PC) substrate. Each PC substrate includes a PC top surface and a PC bottom surface spaced from each other and an edge that runs at least partially about a periphery of the PC substrate between the PC top surface and the PC bottom surface. The edge includes or defines on a facet or edge surface of the edge at least one projection that extends transverse or normal to the facet or edge surface. The projection includes a projection top surface and a projection bottom surface spaced from each other and the projection can include or be made of conductive material.
Status:
Grant
Type:
Utility
Filling date:
9 Jan 2020
Issue date:
11 Jan 2022