SiTime Corporation
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

Last updated:

Abstract:

A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

Status:
Application
Type:

Utility

Filling date:

3 Aug 2020

Issue date:

22 Jul 2021