SiTime Corporation
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
Last updated:
Abstract:
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.
Status:
Application
Type:
Utility
Filling date:
3 Aug 2020
Issue date:
22 Jul 2021