Semtech Corporation
Side-Solderable Leadless Package
Last updated:
Abstract:
A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer.
Status:
Application
Type:
Utility
Filling date:
30 Dec 2020
Issue date:
22 Apr 2021