Semtech Corporation
Side-Solderable Leadless Package

Last updated:

Abstract:

A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer.

Status:
Application
Type:

Utility

Filling date:

30 Dec 2020

Issue date:

22 Apr 2021