Synopsys, Inc.
Methods and systems to perform automated Integrated Fan-Out wafer level package routing

Abstract:

A method, a system, and non-transitory computer readable medium for level package routing are provided. The method includes performing triangulation on a set of nets to generate a routing resource graph. The objects of the set of nets are represented by a respective center point during triangulation. The method also includes generating a route between the objects of the set of nets based on at least a total cost. The total cost is determined based on at least the routing resource graph. The method also includes altering the route based on a determination that a constraint rule is unmet and outputting routing information comprising the route for the set of nets.