Synopsys, Inc.
METHODS AND SYSTEMS TO PERFORM AUTOMATED INTEGRATED FAN-OUT WAFER LEVEL PACKAGE ROUTING
Last updated:
Abstract:
A method, a system, and non-transitory computer readable medium for level package routing are provided. The method includes performing triangulation on a set of nets to generate a routing resource graph. The objects of the set of nets are represented by a respective center point during triangulation. The method also includes generating a route between the objects of the set of nets based on at least a total cost. The total cost is determined based on at least the routing resource graph. The method also includes altering the route based on a determination that a constraint rule is unmet and outputting routing information comprising the route for the set of nets.
Status:
Application
Type:
Utility
Filling date:
12 Aug 2020
Issue date:
18 Feb 2021