Synopsys, Inc.
Layer class relative density for technology modeling in IC technology
Last updated:
Abstract:
A method and apparatus of a novel modeling scheme for performing optical lithography simulation for a multi-color layer fabrication process is described. The method interpolates for simulation use between test or experimental data or descriptions to more accurately apply color differentiated parameters to the model creation and lithography simulation.
Status:
Grant
Type:
Utility
Filling date:
23 Jan 2017
Issue date:
28 Apr 2020