Sony Group Corporation
HEAT INSULATION STRUCTURE AND ELECTRONIC APPARATUS
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Abstract:
A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member.
Status:
Application
Type:
Utility
Filling date:
10 Jun 2020
Issue date:
28 Jul 2022