Sony Group Corporation
HEAT INSULATION STRUCTURE AND ELECTRONIC APPARATUS

Last updated:

Abstract:

A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member.

Status:
Application
Type:

Utility

Filling date:

10 Jun 2020

Issue date:

28 Jul 2022