Skyworks Solutions, Inc.
FRONT END INTEGRATED CIRCUITS INCORPORATING DIFFERING SILICON-ON-INSULATOR TECHNOLOGIES

Last updated:

Abstract:

SOI-based technology platforms are described that provide fully integrated front end integrated circuits (FEICs) that include switches, low-noise amplifiers (LNAs), and power amplifiers (PAs). The PAs can be built in a thick film region of the integrated circuit, resulting in a partially depleted silicon-on-insulator (PDSOI) PA, and the switches and LNAs can be built in a thin film region of the integrated circuit, resulting in fully depleted silicon-on-insulator (FDSOI) switches and LNAs. The resulting fully integrated FEIC includes PDSOI PAs with FDSOI switches and LNAs. Passive components can be built in the thick film region, the thin film region, or both regions.

Status:
Application
Type:

Utility

Filling date:

11 Nov 2021

Issue date:

11 Aug 2022