Synaptics Incorporated
Integrated circuit device and electronic device
Last updated:
Abstract:
An integrated circuit device comprises: a resin film that is flexible; a plurality of traces bonded on a surface of the resin film and arrayed in a specific direction; an IC chip bonded on the surface of the resin film, located offset to the traces in a direction perpendicular to the specific direction, and connected to the traces; and a protection pattern formed on the surface of the resin film, located in the specific direction with respect to a disposition region in which the IC chip and/or the traces are disposed, and formed of the same material as that of the traces.
Status:
Grant
Type:
Utility
Filling date:
2 Oct 2018
Issue date:
9 Nov 2021